Advanced Semiconductor Packaging 2.5D/3D
Integration of multiple dies with interposers, fan-out, wafer bonding, or vertical stacking to improve bandwidth, density, and yield.
Core metadata
- ID: advanced_semiconductor_packaging_2_5d_3d
- Era: Modern
- First known date: 2010 (decade)
- Region: Global semiconductor packaging industry
- Review status: source_checked
- Maturity: established
Prerequisites
- Clean Rooms (clean_rooms)
- Fan-Out Wafer-Level Packaging (fan_out_wafer_level_packaging)
- Hybrid Bonding Advanced Packaging (hybrid_bonding_advanced_packaging)
- Integrated Circuits (Microchips) (integrated_circuits)
- Precision Machine Tools (precision_machine_tools)
- Through-Silicon Vias (through_silicon_vias)
Dependents
- Chiplet Architecture (chiplet_architecture)
- High Bandwidth Memory (high_bandwidth_memory_hbm)
- Silicon Photonics Interconnects (silicon_photonics_interconnects)
Fields
Field lanes
- Semiconductors & Integrated Circuits: Packaging & Interconnect
Node sources
- Heterogeneous Integration Roadmap (IEEE Electronics Packaging Society, 2026, review) • Supports: node, maturity
- 3DFabric (TSMC, 2026, generic_overview) • Supports: node, maturity
- Metrology Needs for 2.5D/3D Interconnect (NIST, 2014, official_agency) • Supports: node, maturity
Prerequisite edge evidence
Edge/source evidence summary:
- Prerequisite edges: 6
- Average edge confidence: 76%
- Prerequisite sources: 10
- expert_inference: 3
- review: 2
- textbook: 1
| Prerequisite | Type | Confidence | Evidence level | Note | Sources |
|---|---|---|---|---|---|
| Integrated Circuits (Microchips) (integrated_circuits) | required | 82% | expert_inference | Integrated Circuits (Microchips) is modeled as a necessary component or method for this technology in the current graph. |
|
| Precision Machine Tools (precision_machine_tools) | enabling | 68% | expert_inference | Precision Machine Tools provides a capability that enables this technology without being the only possible path. |
|
| Clean Rooms (clean_rooms) | enabling | 68% | expert_inference | Clean Rooms provides a capability that enables this technology without being the only possible path. |
|
| Through-Silicon Vias (through_silicon_vias) | enabling | 78% | textbook | Through-silicon vias are used in 2.5D/3D interconnect reference flows, but broad advanced packaging also includes approaches such as fan-out and wafer bonding. |
|
| Fan-Out Wafer-Level Packaging (fan_out_wafer_level_packaging) | enabling | 80% | review | Fan-out wafer-level packaging is a non-TSV advanced-packaging route that uses redistribution layers and reconstituted wafers or panels to integrate dies. |
|
| Hybrid Bonding Advanced Packaging (hybrid_bonding_advanced_packaging) | enabling | 78% | review | Hybrid bonding is a high-density 3D integration route for advanced packaging, distinct from fan-out and from TSV-only interposer flows. |
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