Semiconductor Process Nodes
Generations of semiconductor manufacturing defined by device architecture, density, lithography, interconnect, and process design rules.
Core metadata
- ID: semiconductor_process_nodes
- Era: Modern
- First known date: 1979 (exact)
- Region: United States and global semiconductor manufacturing roadmaps
- Review status: source_checked
- Maturity: established
Prerequisites
- Chemical Mechanical Planarization (chemical_mechanical_planarization)
- DUV Stepper Lithography (duv_stepper_lithography)
- VLSI Design (vlsi_design)
Dependents
- Backside Power Delivery (backside_power_delivery)
- FinFET Transistors (finfet_transistors)
- High-NA EUV Lithography (high_na_euv_lithography)
Fields
Field lanes
- Semiconductors & Integrated Circuits: Fabrication & Lithography
Node sources
- The Silicon Engine (Computer History Museum, 2007, museum) • Supports: node, maturity
- EUV Lithography Systems (ASML, 2026, generic_overview) • Supports: node, maturity
Prerequisite edge evidence
Edge/source evidence summary:
- Prerequisite edges: 3
- Average edge confidence: 68%
- Prerequisite sources: 3
- expert_inference: 3
| Prerequisite | Type | Confidence | Evidence level | Note | Sources |
|---|---|---|---|---|---|
| VLSI Design (vlsi_design) | enabling | 68% | expert_inference | Process-node generations are meaningful in the VLSI-era design-rule and scaling context, not at the first integrated-circuit date. |
|
| DUV Stepper Lithography (duv_stepper_lithography) | enabling | 68% | expert_inference | DUV Stepper Lithography provides a capability that enables this technology without being the only possible path. |
|
| Chemical Mechanical Planarization (chemical_mechanical_planarization) | enabling | 68% | expert_inference | Chemical Mechanical Planarization provides a capability that enables this technology without being the only possible path. |
|
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